SHORT COURSES/TUTORIALS
On Monday 12th September, before the Conference opens, there will be a number of short courses run in a tutorial mode. Preliminary information on the courses are shown below. To register for Short Courses please click here
The fee for each Half-day Course is £200 + VAT
The fee for two Half-day Courses (morning + afternoon) is £350 +VAT
The fee for each Full-day Course is £350 + VAT
UK VAT is currently 20%
Payment must be received in advance in order for a participant to attend the selected Course. The organisers reserve the right to cancel a course if there are insufficient registrations. In that event, the fee paid will be refunded to the registered participant.
SC1: Introduction to Low Temperature Co-fired Ceramic Technology (LTCC)
(Click here to download the PDF of the Course and Instructor details)
Date, Time and Location: 12th September 2011, 09.00-12.30, Hilton Metropole, Brighton.
Instructor: Prof. Marc Desmulliez. Head of Microsystems Engineering Centre (MISEC), Institute for Integrated Systems, Heriot-Watt University, Edinburgh, Scotland
Half-day Course:
- Introduction to the LTCC process
- Properties of the ceramic green tapes
- New ablative processes: Laser ablation and abrasive jet micro-machining
- Example of devices manufactured using LTCC
- State of the art optoelectronic and Microsystems components based on LTCC
SC2: Beyond Solder - Helping You Make Reliable Connections
(Click to download the PDF of the Course and Instructor details)
Date, Time and Location: 12th September 2011, 14.00-17.30, Hilton Metropole, Brighton.
Instructor: Martin Wickham, Research Consultant, Electronics Interconnection Team at the National Physical Laboratory, England.
Half-day Course:
- Ultrasonically bonded interconnects
- Reliable connections for harsh environments
- Conductive adhesives for chip bonding
- Press-fit connections for high reliability applications
- Nano-scale interconnects
- Innovative die & component attach materials
- Industrial 'Solder Free' connections
SC3: Progressive Advances in High Density Substrates & Packaging – to Deliver More than Moore
(Click to download the PDF of the Course and Instructor details)
Date, Time and Location: 12th September 2011, 09.00-12.30, Hilton Metropole, Brighton.
Instructor: Dr Bernd Appelt. Director, Advanced Semiconductor Engineering, California, USA.
Half-day Course:
- Industry landscape
- Technology supply chain matching - assembly technology, substrate technology, system technology
- Market dynamics driving package and substrate development
- Technology 'r'evolution shift from CPU to mobile applications
- Maturing of buildup substrate technology
- Package miniaturization and functional integration representing 'More Moore' and 'More than Moore'
- Substrates for fine-pitch assembly applications
- Embedded active/passive substrates
- Examples/ illustrations of advanced substrate applications in servers, hand helds, and high end servers and communication equipments: PoP (Package on Package), EAD (Embedded Active Devices), Si interposers, WLP (Wafer Level Packages), etc
SC4: NanoPackaging - An Introduction to Nanotechnologies in Microelectronics Packaging
(Click to download the PDF of the Course and Instructor details)
Date, Time and Location: 12th September 2011, 14.00-17.30, Hilton Metropole, Brighton.
Instructor: Prof. James Morris, Portland State University, Oregon, USA
Half-day Course:
- Introduction to Electronics Packaging
- Introduction to Nanotechnologies in Electronics Packaging
- Nanoparticles
- Nanoparticle properties: melting point depression, coulomb block, sintering, etc
- Nanoparticle fabrication o Embedded passives: nanoparticles for high-k capacitors, resistors, and inductors
- Nanoparticles in electrically conductive adhesives,
- Nanoparticles in microvias and conductive inks for SMT interconnect
- Nanoparticles added to lead-free solders and flip-chip underfills
- Carbon Nanotubes:
- CNTs: fabrication, characterization (chirality, etc), and properties
- CNTs for thermal management and electromagnetic shielding
- CNT effects in solders
- Miscellaneous
- Nanowires and nanoscale spring interconnects
- Molecular dynamics and modelling across the length scales
SC5: High Brightness Light Emitting Diodes - Reliability Considerations
(Click to download the PDF of the Course and Instructor details)
Date, Time and Location: 12th September 2011, 09.00 – 12.30, Hilton Metropole, Brighton
Instructor: Greg Caswell, Sr. Member of the Technical Staff, DfR Solutions, Maryland, USA
Half-day Course:
- Drawbacks to Conventional Lighting
- LED History and Market Growth
- Getting the Light Out
- LED Failure Modes and Degradation
- Electrical, Mechanical, Thermal Runaway, Threading Dislocations, ESD/EOS, Colour
- LED Package Issues
- Applications
- Medical, Automotive, Industrial, Signage, Traffic Signals, Street Lights
- Thermal Management
- Wafer Level Packaging
- TSV
- Energy Star Requirements
- Lifetime Requirements
- Reliability and Design
SC6: Wire Bonding in Microelectronics
(Click to download the PDF of the Course and Instructor details)
Date, Time and Location: 12th September 2011, 09.00 – 17.00, Hilton Metropole, Brighton.
Instructor: Lee Levine. Principal Consultant, Process Solutions Consulting USA
Full-day Course:
- The Ball Bond Process: Step by Step Wire Bonding
- Welding
- The effect of ultrasonics on weld formation and materials properties
- Metallurgy and Intermetallics
- A comparison of the welds associated with Au-Al and Al-Cu bonding
- Au-Al failure mechanisms in ultra-fine pitch bonding
- The effect of wire alloying on ultra-fine pitch reliability
- Wire properties, testing and chemistry
- Pull and shear testing wire bonds
- Long term accelerated testing of wire bonds
- Understanding wire stiffness and the effect on looping
- Wire bond loop shapes
- The second bond
- Diffusion
- The principal bonding variables
- Capillary design and selection for optimized processes
- Simple bond screening designed experiments
- How to optimize the bonding process
